Electronic device comprising an optical chip and method of fabrication

ABSTRACT

An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional from U.S. application patent Ser. No. 16/573,023, filed Sep. 17, 2019, which claims the priority benefit of French Application for Patent No. 1858737, filed on Sep. 25, 2018, the contents of which are hereby incorporated by reference in their entireties to the maximum extent allowable by law.

TECHNICAL FIELD

The present invention relates to the field of microelectronics and, more particularly, that of electronic housings comprising encapsulation covers of electronic chips mounted on carrier wafers.

SUMMARY

In an embodiment, an electronic device comprises: a carrier substrate having a front mounting face; an electronic chip mounted on the front mounting face of the carrier substrate and having, in its front face, an optical component; an encapsulation cover of the chip, which is mounted on top of the front face of the carrier substrate, which bounds a chamber within which the chip is situated and which has a front opening situated in front of the optical component of the chip; and an optical element, designed to allow light to pass, which covers the front opening of the encapsulation cover and which is mounted on the encapsulation cover on the same side as the chip.

Thus, the assembly is facilitated and precise.

The optical element may comprise a positioning pattern on the same side as the chip.

The optical element may comprise a base wafer and a back layer situated on the same side as the chip and having a central region designed to deviate the light and a positioning pattern.

The encapsulation cover may have, around the through passage, a back mounting face which comprises at least one contact area on which a front face of the optical element is resting and which comprises at least one local cavity which is recessed with respect to the contact area, this local cavity, on the one hand, forming spaces between the front face of the optical element and the bottom of the local cavity and, on the other hand, extending and being uncovered beyond one edge of the optical element.

At least one drop of adhesive for fixing the optical element may extend locally into the local cavity.

The drop of adhesive may have a covered portion between the local cavity and the optical element and an uncovered portion which extends beyond the edge of the optical element,

The bottom of the local cavity may have a protruding boss which extends facing and at a distance from the front face of the optical element, the drop of fixing adhesive extending over this protruding boss.

The protruding boss may have a portion covered by the optical element and an uncovered portion situated beyond the edge of the optical element.

The local cavity may be situated at a distance from the through passage and separated from this through passage by the contact area.

The optical element may comprise a base wafer and a back layer including a central part designed to deviate the light and a detectable positioning pattern.

In an embodiment, a method of fabricating an electronic device comprises: providing, on the one hand, a carrier substrate on a front face of which at least one electronic chip is mounted comprising an optical component and, on the other hand, an encapsulation cover having a front opening and an optical element through which light is able to pass; mounting the optical element on the encapsulation cover, behind the front opening; and mounting the encapsulation cover on top of the front face of the carrier substrate, in a position such that the chip is situated in a chamber bounded by the encapsulation cover and that the optical element is in front of the optical component of the chip, the optical axes of the optical component of the chip and of the optical element being situated on a common optical axis.

The mounting of the encapsulation cover may comprise: placing the encapsulation cover equipped with the optical element in a reference position; detecting a positioning pattern of the optical element through the back of the encapsulation cover, with respect to a position of the carrier substrate or of the chip mounted on the carrier substrate; and moving and mounting the encapsulation cover on top of the carrier substrate, starting from the reference position and according to a movement and mounting program.

BRIEF DESCRIPTION OF THE DRAWINGS

Electronic devices will now be described by way of non-limiting exemplary embodiments, illustrated by the drawing in which:

FIG. 1 shows a longitudinal cross-section of an electronic device

FIG. 2 shows a view from the back towards the front of an encapsulation cover, equipped with an optical element, of the electronic device in FIG. 1 ; and

FIG. 3 shows a view from the back towards the front of the encapsulation cover, without the optical element.

DETAILED DESCRIPTION

An electronic device 1, illustrated in the figures, comprises a carrier substrate 2, in the form of a wafer, which has a back face 3 and a front mounting face 4 and which includes an integrated network 5 of electrical connections from one face to the other. The carrier substrate 2 is made of an opaque material.

The electronic device 1 comprises an electronic chip 6 which is fixed onto the front face 4 of the carrier substrate 2, by means of a layer of adhesive (not shown) and which comprises, in its front face 7, an optical component 8 designed to emit or to receive light radiation. The chip 6 is electrically connected to the network of electrical connections 5, for example, by one or more electrical wires 9.

The electronic device 1 comprises an encapsulation cover 10 which is fixed on top of the front face 4 of the carrier substrate 2 and which bounds a chamber 11 inside of which the chip 6 is situated. The encapsulation cover 10 is made of an opaque material.

The encapsulation cover 10 has a local front opening 12 situated in front of the optical component 8 of the chip 6.

The electronic device 1 comprises an optical element 13, designed to allow light radiation to pass through, in the form of a wafer, which is disposed within the chamber 11 in front of the chip 6 and which is fixed to the encapsulation cover 10 so as to cover the front opening 12.

Advantageously, the encapsulation cover 10 comprises a peripheral wall 14 whose back edge 15 is fixed on top of the periphery of the front face 4 of the carrier substrate 2, by means of a bead of adhesive 16, and a forward frontal wall 17 which has the front opening 12 and which has, around the front opening 12, a back face 18 for mounting the optical element 13.

The optical element 13 has a central region 19 designed to deviate the light and a positioning pattern 20. Advantageously, the central region 19 and the positioning pattern 20 are on the back side of the optical element 13, in other words on the same side as the chip 6.

The optical axes of the optical component 8 of the chip 6 and of the central region 19 of the optical element 13 and the axis of the local front opening 12 of the encapsulation cover 10 are situated on a common optical axis, so as to obtain a correct alignment, this common optical axis being perpendicular to the front face of the chip 6 and to the carrier substrate 2. The local front opening 12 of the encapsulation cover 10 forms an optical interface.

According to one variant embodiment, the optical element 13 comprises a base wafer 21, for example made of glass, and, on a back face of this base wafer 21, in other words on the same side as the chip 6, a back layer 22 of structured polymer in order to form the central region 18 designed to deviate the light and the positioning pattern 19.

Optionally, the optical element 13 comprises a front layer (not shown), designed to form a filter, for example a UV filter.

In the case where the optical component 8 of the chip 6 is an emitter of light, the central region 18 of the layer 22 of the optical element 13 is advantageously designed to produce a multidirectional dispersion, towards the outside through the wafer 21 and the local front opening 12 of the encapsulation cover 10.

In the case where the optical component 8 of the chip 6 is a receiver of light, the central region 18 of the layer 22 of the optical element 13 advantageously forms a converging optical lens designed to make the light coming from the outside through the local front opening 12 of the encapsulation cover 10 and of the wafer 21 converge towards the optical component 8.

According to one variant embodiment, the internal back mounting face 18 of the frontal wall 17 comprises local contact surfaces 23 and 24 on which the front face of the optical element 13 is resting. Since the optical element 13 is disposed in a longitudinal direction, the local contact surfaces 23 and 24 are situated longitudinally on either side of the local opening 12 and join opposite sides of the peripheral wall 14.

The mounting face 18 of the frontal wall 17 comprises, on longitudinally opposing regions with respect to the through passage 4 and to the local contact surfaces 23 and 24, local cavities 25 and 26 recessed or in a dip with respect to the contact surfaces 23 and 24. These local cavities 25 and 26 form spaces between the front face of the optical element 13 and the bottoms of the cavities 25 and 26 and extend and are uncovered beyond opposite edges 27 and 28 of the optical element 13, in other words not covered by the optical element 13.

The optical element 13 is fixed to the frontal wall 3 by means of local drops of fixing adhesive 29 and 30 which extend locally into the cavities 25 and 26 and which respectively have portions 29 a and 30 a covered by end parts of the optical element 5, adjacent to opposing edges 13 and 14 of the optical element 5, and uncovered portions 29 b and 30 b situated beyond opposing edges 27 and 28 of the optical element 5.

Advantageously, the bottoms of the cavities 25 and 26 have protruding bosses 31 and 32 which are situated at a distance from the edges of the cavities 25 and 26 and which have end faces which extend facing and at a distance from the front face of the optical element 13 and which extend beyond opposing edges 27 and 28 of the optical element 13.

The drops of adhesive 29 and 30 are situated on the protruding bosses 31 and 32. Nevertheless, the drops of adhesive 29 and 30 may spill over beyond the edge of the protruding bosses 31 and 32. Advantageously, the drops of adhesive 29 and 30 do not reach the contact surfaces 23 and 24.

The recessed spaces, situated between the contact surfaces 24 and 25 and passing underneath the optical element 13, form ventilation or aeration channels for the chamber 11.

The electronic device 1 may be fabricated in the following manner.

Provide, on the one hand, a carrier substrate 2 on which a chip 6 is mounted and electrically connected and further provide, on the other hand, a prefabricated encapsulation cover 10, for example obtained by an injection process, and an optical element 13.

Using a syringe, drops of adhesive 29 and 30, in the liquid state, are locally dispensed in the hollowed out cavities 25 and 26 of the mounting internal back face 18 of the encapsulation cover 10. More precisely, drops of adhesive 29 and 30 are dispensed on the ends of the protruding bosses 31 and 32. By virtue of the capillarity effects, the drops of adhesive 29 and 30 have a tendency to stay on the protruding bosses 31 and 32 and do not flow away towards the rest of the cavities 25 and 26. In particular, the drops of adhesive 16 and 17, in the liquid state, do not reach the contact surfaces 23 and 24. The drops of adhesive are, for example, composed of an epoxy material.

By means of a transfer and positioning tool, via the back of the encapsulation cover 10, the optical element 13 resting on the contact surfaces 23 and 24 is installed, placing the axis of the central region 19 designed to deviate the light of the optical element 13 along the axis of the front opening 12 and placing the positioning pattern 20 according to a desired position for the orientation of the optical element 13 with respect to the encapsulation cover 10 or the axis of the central region 19 designed to deviate the light of the optical element 13. This operation is carried out by visually detecting the positioning pattern 17 through the back of the encapsulation cover 10. By doing so, the end parts of the optical element 13, adjacent to its edges 27 and 28, squash the drops of adhesive 29 and 30 so as to form their covered portions 29 a and 30 a and the uncovered portions 19 b and 30 b.

Immediately while it is being held, a step for local tacking of the optical element 13 onto the encapsulation cover 10 is carried out by means of a first piece of equipment (not shown).

For example, the transfer and positioning tool being equipped with a device designed to emit ultraviolet radiation, this emission is temporarily activated in the direction of the uncovered portions 29 b and 30 b of the drops of adhesive 29 and 30, in such a manner as to make the drops of adhesive 29 and 30 harden, at least partially, and to cause local tacking points of the optical element 13 on the cover 10.

Subsequently, the transfer and positioning tool is removed.

In a further step, a definitive fixing of the optical element 13 onto the cover 10 is carried out, by means of a second piece of equipment (not shown). For example, the encapsulation cover 10 is transferred into a curing oven, so as to make the drops of adhesive 29 and 30 completely harden, at a suitable temperature, and to cause a complete fixing of the optical element 13 onto the cover 10.

It goes without saying that the chosen adhesive is designed to be hardened by ultraviolet radiation and by heat, for example a suitable epoxy adhesive.

Then, using a syringe, a bead of adhesive 16 is dispensed, in the liquid state, onto the periphery of the front face 4 of the carrier substrate 2.

Subsequently, a transfer and positioning tool places the encapsulation cover 10, equipped with the optical element 13, in a reference position established with respect to a fixed position of the carrier substrate 2 and of the chip 6 mounted on the carrier substrate 2, while implementing a detection tool designed to detect the positioning pattern 20, through the back of the encapsulation cover 10.

Then, starting from the reference position and under the effect of a suitable motion program, the transfer and positioning tool brings and mounts the encapsulation cover 10 equipped with the optical element 13 on top of the carrier substrate 2, in the installed position previously described, the bead of adhesive 16 then being squashed.

Subsequently, the bead of adhesive 16 is made to harden so as to fix the encapsulation cover onto the carrier substrate 2.

The electronic device 1 is then formed.

According to one variant embodiment, an electronic device (not shown) comprises, generally speaking, two elementary electronic devices respectively equivalent to the electronic device 1 illustrated in FIGS. 1 to 3 , one comprising an emitting chip specifically designed to emit light towards the outside and the other comprising a receiving chip specifically designed to capture the external light.

In this case, a common carrier substrate holds the emitting and receiving chips at a distance from one another.

A common encapsulation cover comprises a peripheral wall bonded on top of the periphery of the front face of the common carrier substrate and an internal partition which passes between and at a distance from the emitting and receiving chips and is bonded on top of the common carrier substrate and which bounds two internal chambers within which the emitting and receiving chips are respectively situated.

In front of the emitting and receiving chips, respectively, the common encapsulation cover has local front openings and carries specific optical elements, the optical element situated in front of the emitting chip comprising a central region designed to disperse the emitted light and the optical element situated in front of the receiving chip comprising a central region forming an optical lens.

In an equivalent manner to what has previously been described, the positioning patterns of the optical elements are implemented in order to mount these optical elements in desired positions on the common encapsulation cover and to mount, starting from a reference position, the common encapsulation cover on top of the common carrier substrate in a desired position.

According to one mode of operation, the emitting chip emits light radiation towards the outside and the receiving chip captures the external light radiation.

The electronic device thus formed may advantageously detect the presence or the absence of an object reflecting the light emitted by the emitting chip towards the receiving chip and hence may constitute a proximity detector.

According to one particular exemplary configuration, the electronic device thus formed is placed behind a transparent wall of a device, in a position such that this transparent wall is in front and at a short distance from the common encapsulation cover, the local openings being dimensioned to protect the receiving chip against the radiation from the emitting chip between the transparent wall of the device and the common encapsulation cover.

The electronic device thus formed may advantageously be installed inside a mobile telephone or an electronic tablet, behind a transparent wall. 

1. A method of fabricating an electronic device, comprising: providing a carrier substrate having a front face to which at least one electronic chip is mounted; providing an encapsulation cover having a front opening and, around the front opening, a back mounting face which comprises at least one contact area and at least one local cavity which is recessed with respect to the at least one contact area; providing an optical element through which light is able to pass, wherein the optical element includes a central region designed to deviate the light; mounting the optical element to the encapsulation cover at a position behind the front opening, wherein mounting comprises: applying a drop of adhesive; positioning a face of the optical element in contact with the at least one contact area of the back mounting face; wherein said drop of adhesive fixes the optical element to the back mounting face and extends locally into the at least one local cavity; and mounting the encapsulation cover on top of the front face of the carrier substrate, in a position such that the electronic chip is situated within a chamber bounded by the encapsulation cover and that the optical element is in front of the optical component of the electronic chip.
 2. The method according to claim 1, wherein providing the optical element further comprising providing the optical element with a positioning pattern.
 3. The method according to claim 2, wherein mounting the encapsulation cover further comprises: placing the encapsulation cover equipped with the optical element in a reference position; detecting the positioning pattern of the optical element through a back of the encapsulation cover with respect to a position of at least one of the carrier substrate and the electronic chip mounted on the carrier substrate; and moving and mounting the encapsulation cover on top of the carrier substrate, starting from the reference position and according to a movement and mounting program.
 4. The method of claim 3, wherein the optical element is positioned in front of the optical component of the electronic chip, with optical axes of the optical component of the electronic chip and of the optical element being situated on a common optical axis.
 5. The method according to claim 2, wherein the positioning pattern is visible through the front opening.
 6. The method according to claim 2, wherein the optical element comprises a base wafer and a back layer, and wherein the back layer includes said central region and said positioning pattern.
 7. The method of claim 1, wherein said at least one local cavity forms spaces between the face of the optical element and a bottom of the at least one local cavity.
 8. The method of claim 1, wherein said at least one local cavity extends beyond and is uncovered by an edge of the optical element.
 9. The method of claim 1, wherein providing the encapsulation cover further comprises providing, in the at least one local cavity, at least one protruding boss.
 10. The method of claim 9, wherein said drop of adhesive is applied to a surface of the protruding boss.
 11. The method of claim 9, wherein said drop of adhesive is positioned between the face of the optical element and a surface of the protruding boss.
 12. The method of claim 9, wherein said at least protruding boss extends beyond and is uncovered by an edge of the optical element.
 13. The method according to claim 1, wherein the at least one local cavity is situated at a distance from the front opening and separated from the front opening by the at least one contact area. 